Marketplace/Non-Ferrous Copper/#2 Copper Wire

Non-Ferrous Copper

#2 Copper Wire

Grade: Birch (Secondary Grade)High Tier

Miscellaneous unalloyed copper wire with solder, paint or oxidation

Market Price EstimateUpdated Daily

$3,450/ MT

+195 (6%)vs yesterday

Verified specifications & market data

Overview Specifications Price Calculator Logistics & Handling Compliance

Chemical Composition

Elemental breakdown by percentage weight.

Standard composition limits

Values represent maximum allowed percentage unless otherwise noted.

Physical Properties

Material form, density, and contamination specifications.

Secondary grade copper wire scrap; allows coating, solder, oxidation, and contamination within tolerances; requires secondary smelter processing

Acceptable Inclusions

Solder or solder coating (PRIMARY #2 CHARACTERISTIC)
Paint, varnish, protective coating
Heavy oxidation/tarnish
Light ferrous oxidation
Minor brass/zinc contamination <2%
Light nickel/tin plating residue
Mixed metal contamination <5% combined

Prohibited Materials

Insulation (plastic coating; must be stripped wire)
Stainless steel mixing (magnetic test to exclude)
Aluminum or non-ferrous >0.5% individual
Lead >0.5% (secondary smelter limit)
Radioactive materials
PCB components (electronics without stripping)
Hazardous materials
Asbestos

Quality Assurance

Testing protocols, sampling methods, and acceptance criteria.

Sampling Protocol

frequencyRandom selection from load sections

maximumQuantity50–75 samples per load

minimumQuantity1–3 tonnes or 30–50 samples

notesSecondary grade allows more flexible sampling

percentage10–15% of lot

Acceptance Limits

copper ContentCu ≥95.0%

iron LimitFe <0.5%

lead LimitPb <0.5%

nickel LimitNi <0.5%

paint Presence

solder Presence

tin LimitSn <0.5%

total ContaminantsCombined non-copper <5%

visual ContaminantsSolder/paint/oxidation acceptable; insulation

zinc LimitZn <2.0%

Weight Tolerance

variance±5% from purchase order weight

Required Test Methods

Visual Inspection

Method 1

Purpose

Confirm primarily copper wire
detect gross contamination
assess solder/paint presence

Acceptance Criteria

Pass: Predominantly copper appearance
solder/paint acceptable
NO plastic insulation

Procedure

100% visual scan
confirm no insulation (stripped wire only)

Magnetic Test

Method 2

Purpose

Exclude ferrous contamination/stainless mixing

Acceptance Criteria

Pass: No strong magnetic response (minimal ferrous acceptable)

XRF Spectrometry

Method 3

Purpose

Verify Cu ≥95%, contaminants within secondary limits

Acceptance Criteria

Pass: Cu 95–100%
Pb <0.5%, Zn <2%, combined <5%

Visual Solder/Paint Assessment

Method 4

Purpose

Document solder and paint presence (informational)

Acceptance Criteria

Pass: Solder/paint noted but acceptable

Weight-Based Assessment

Method 5

Purpose

Quick purity estimate (density indicating contamination)

Acceptance Criteria

Pass: Material within acceptable weight range