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Precious Metals
Computer Chips
Grade: VariousHigh Tier
CPUs, RAM, processors with gold bonding wire
Market Price EstimateUpdated Daily
$24,500/ MT
+1450 (6.3%)vs yesterday
Verified specifications & market data
Chemical Composition
Elemental breakdown by percentage weight.
Standard composition limits
Values represent maximum allowed percentage unless otherwise noted.
Physical Properties
Material form, density, and contamination specifications.
Post-consumer/post-industrial e-waste semiconductors; obsolete computer processors and memory chips; vintage to modern chips; ultra-low individual gold content but high-volume distributed source; established e-waste recycling infrastructure; semiconductor waste stream; precious metal recovery marginal per unit but significant in aggregate; RoHS/WEEE hazmat protocols critical
Acceptable Inclusions
- Gold 0.01-0.10g bonding wire + plating (specification)
- Copper 1-10g in lead frame (base metal)
- Silicon 0.1-5g (semiconductor die)
- Tin 0.1-2g (solder component)
- Epoxy resin 2-20g (encapsulation)
- Lead solder <1g (legacy chips acceptable trace)
- Surface oxidation/corrosion (expected use)
Prohibited Materials
- Gold <0.01g per chip (below specification)
- Lead >0.1% (RoHS exceeds)
- Cadmium >0.01% (RoHS exceeds)
- Mercury >0.001% (RoHS exceeds)
- Unknown chip composition (RoHS uncertain)
- Batteries or hazardous components present
Quality Assurance
Testing protocols, sampling methods, and acceptance criteria.
Sampling Protocol
frequencyRandom stratified sampling from different chip types; generation variation
maximumQuantity1000+ chips per shipment
minimumQuantity100-500 chips or 1-5 kg
percentage5-10% of lot
stratificationSample across processor types; memory types; graphics cards; age diversity
Acceptance Limits
all Criteria Must Pass: computer chip confirmed; gold bonding wire verified; RoHS compliant likely; chip integrity acceptable; processing-ready
chip Authenticitycomputer semiconductor chip; bonding wire/leads apparent; encapsulation identifiable
chip IntegrityEncapsulation sound; leads intact; processing/refining feasible
copper Lead FrameCopper lead frame 1-10g per chip confirmed; base metal component value verified
gold PresenceGold bonding wire/plating confirmed present; precious metal architecture verified
rohs ComplianceRoHS compliance probable; hazmat elements within tolerance; Pb <0.1%, Cd <0.01%, Hg <0.001%
Weight Tolerance
measurementVerified by certified scale; weight certificate typical for e-waste industrial shipments
variance±10% from expected weight
Required Test Methods
Visual Inspection & Chip Identification
CRITICAL
Purpose
- confirm computer semiconductor chips
- identify chip types (CPU, RAM, GPU)
- verify encapsulation integrity
- assess industrial condition
Acceptance Criteria
- Semiconductor chips clearly identifiable
- chip types confirmed
- leads/bonding apparent
- encapsulation intact
- industrial e-waste condition clear
Procedure
- 100% sample visual inspection
- identify processor/memory types
- confirm chip authenticity (NOT passive/wrong component)
- assess lead oxidation/corrosion levels
Chip Type & Generation Classification
CRITICAL
Purpose
- categorize by generation (legacy vs. modern)
- estimate RoHS compliance
- predict lead/mercury hazmat levels
Acceptance Criteria
- Chip generation identified
- RoHS likelihood assessed
- manufacturing era estimated
- hazmat profile predictable
Gold Bonding Wire & Precious Metal Assessment
CRITICAL
Purpose
- verify gold bonding wire present
- visual confirmation of precious metal architecture
Acceptance Criteria
- Gold bonding wire confirmed present (ultra-thin visible in high-power inspection or XRF detected)
- precious metal content confirmed
Lead & Hazmat RoHS Screening
MANDATORY
Purpose
- detect lead solder <0.1%
- cadmium <0.01%
- mercury <0.001%
- assess RoHS compliance
Acceptance Criteria
- Pb <0.1%, Cd <0.01%, Hg <0.001%
- RoHS compliance confirmed
- hazmat within tolerance
Chip Integrity & Encapsulation Assessment
Purpose
- Evaluate chip condition
- assess encapsulation integrity
- determine processing feasibility
- verify refining-ready status
Acceptance Criteria
- Encapsulation sound
- leads/bonding intact
- no severe corrosion
- processing feasible
- refining-ready
Contamination Assessment
Purpose
- Evaluate dust, oxidation, solder flux residue
- assess industrial post-use condition
- confirm commodity tolerance
Acceptance Criteria
- Post-industrial condition acceptable (oxidation/dust expected)
- no severe contamination
- processing feasible
XRF Elemental Analysis
Purpose
- COMPREHENSIVE verification of precious metal content (gold 0.01-0.10g) + hazmat assessment (Pb, Cd, Hg)
Acceptance Criteria
- Gold 0.01-0.10g bonding confirmed, Copper 1-10g lead frame confirmed, Pb <0.1% (RoHS), Cd <0.01%, Hg <0.001%