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RAM Memory Modules
Electronic Scrap

RAM Memory Modules

Grade: VariousHigh Tier

Computer memory sticks with gold edge connectors

Market Price EstimateUpdated Daily
$2,850/ MT
+165 (6.1%)vs yesterday
Verified specifications & market data

Chemical Composition

Elemental breakdown by percentage weight.

Standard composition limits
Values represent maximum allowed percentage unless otherwise noted.

Physical Properties

Material form, density, and contamination specifications.

End-of-life computer memory modules; universal computing component; moderate precious metal content (0.02-0.15g gold concentrated on edge connectors; 5-30g copper; precious metal recovery gold-focused on connectors); ubiquitous e-waste stream (memory in every computer); SUBSTANTIAL supplier base (245 suppliers); volume-driven commodity; edge connector gold primary value driver; environmental straightforward (RoHS modern standard); industry-specific classification standardized

Acceptable Inclusions
  • Gold plating 0.02-0.15g (memory specification; edge connectors)
  • Copper 5-30g (secondary value; acceptable)
  • Nickel <2g (plating component)
  • Silver <1g (trace)
  • Solder 2-15g (lead-free modern typical)
  • PCB substrate 5-50g (light; inert)
  • Semiconductor chips 3-20g (inert silicon)
  • Minor dust/oxidation (typical post-use)
Prohibited Materials
  • Gold <0.02g (below memory specification)
  • Mercury components (memory non-compliant)
  • Batteries attached (active hazmat)
  • Severe corrosion/degradation

Quality Assurance

Testing protocols, sampling methods, and acceptance criteria.

Sampling Protocol
frequencyStratified random sampling by generation; generation diversity verification
maximumQuantity500+ modules per shipment
minimumQuantity50-200 modules or 10-30 kg
percentage10-15% of lot
stratificationSample across different memory generations; module types; pin counts; generation mix validation
Acceptance Limits
all Criteria Must Pass: memory module confirmed; generation ; gold connectors confirmed; generation mix ; pricing adjustment applied
copper ContentCopper 5-30g confirmed; secondary value component verified
generation IdentifiedMemory generation confirmed; pin count verified; type established
generation MixGeneration distribution documented; weighted average gold calculated; pricing adjustment determined
gold ConnectorsGold edge connectors evident; precious metal architecture confirmed; 0.02-0.15g range verified
memory Authenticitycomputer memory module; specification verified
rohs ComplianceRoHS compliance likely; no obvious hazmat; memory standard met
Weight Tolerance
measurementVerified by certified scale; weight certificate typical for memory shipments
variance±3% from expected weight

Required Test Methods

Visual Inspection & Memory Type Identification

CRITICAL
Method 1
Purpose
  • identify memory type (SDRAM/DDR/DDR2/DDR3/DDR4/DDR5)
  • confirm pin count
  • estimate gold content by generation
  • assess condition
Acceptance Criteria
  • Memory module clearly identified
  • generation confirmed by pin count/substrate
  • gold edge connectors evident
  • condition acceptable
Procedure
  • 100% sample visual inspection
  • identify pin count (168=SDRAM, 184=DDR, 240=DDR2/3, 288=DDR4)
  • confirm generation
  • assess connector gold brightness/coverage

Memory Generation Verification

CRITICAL
Method 2
Purpose
  • verify memory generation
  • estimate gold content by DDR type
  • predict precious metal value and generation mix impact
Acceptance Criteria
  • Generation identified (DDR2/3/4)
  • gold content estimate aligned with type
  • generation-based value confirmed

Edge Connector Gold Assessment

CRITICAL
Method 3
Purpose
  • assess gold plating on edge connectors (primary value)
  • verify precious metal presence
  • estimate plating thickness/coverage
Acceptance Criteria
  • Gold connectors evident
  • plating coverage confirmed
  • precious metal architecture apparent
  • connector gold 0.02-0.15g confirmed

Generation Mix Validation

CRITICAL
Method 4
Purpose
  • confirm generation distribution (DDR2% vs. DDR3% vs. DDR4%)
  • calculate weighted average gold per module
  • determine premium/discount
Acceptance Criteria
  • Generation mix documented
  • weighted average gold calculated
  • pricing adjustment determined
Procedure
  • Sample generation distribution
  • calculate DDR2/3/4 percentages
  • determine gold weighting
  • apply generation-mix premium/discount

Copper Content Assessment

Method 5
Purpose
  • Verify copper 5-30g per module
  • secondary commodity value confirmation
Acceptance Criteria
  • Copper content within range
  • secondary value component verified

Hazmat RoHS Spot-Check

Method 6
Purpose
  • Verify RoHS compliance
  • confirm no mercury/extreme hazmat
  • memory standard compliance
Acceptance Criteria
  • RoHS compliance likely
  • no obvious hazmat detected
  • memory standard met

XRF Elemental Analysis

Method 7
Purpose
  • COMPREHENSIVE verification of gold content (0.02-0.15g GENERATION-DEPENDENT) + copper (5-30g) + hazmat (Pb, Cd, Hg)
Acceptance Criteria
  • Gold 0.02-0.15g (GENERATION CONFIRMED: DDR2 higher, DDR4 lower), Copper 5-30g, Pb <0.1% (RoHS), Cd <0.01%, Hg <0.001%
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