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Electronic Scrap
RAM Memory Modules
Grade: VariousHigh Tier
Computer memory sticks with gold edge connectors
Market Price EstimateUpdated Daily
$2,850/ MT
+165 (6.1%)vs yesterday
Verified specifications & market data
Certification Requirements
Required certifications, standards compliance, and verification protocols.
ISO 9001:2015 Quality Management System
Scope
Memory module e-waste collection, sorting, verification, extraction, quality control, recycling
Requirement
Supplier must maintain active ISO 9001 certification throughout contract term
Certification BodyAccredited third-party audit body
RenewalAnnual audit required; certification must remain current
WEEE Directive Compliance Certificate
Scope
- Waste Electrical & Electronic Equipment Recycling Compliance
- Computing Memory Category
Content
- WEEE registration verified (established processor)
- Producer responsibility organization (PRO) compliance
- Treatment standards compliance (memory extraction)
- Precious metal recovery protocols established
- Hazardous element management (lead, mercury, cadmium - memory-specific minimal)
- Recycling rate achievement targets compliance
Requirement
- Full Weee Compliance Documented
- Memory Recycling Protocols Followed
- Environmental Management
RoHS Directive Compliance Certificate
Explicit Requirement
MUST state:
- RoHS Directive compliance verified
- memory modules contain Pb <0.1%, Cd <0.01%, Hg <0.001%
- hazardous substance limits CONFIRMED
- modern memory standard compliance DOCUMENTED
Certificate of Analysis
Content
- Memory module type/generation confirmed (DDR2, DDR3, DDR4, DDR5; JEDEC verification)
- Memory module pin count verified (168=SDRAM, 184=DDR, 240=DDR2/3, 288=DDR4)
- Gold edge connector content: 0.02-0.15g per module DOCUMENTED (CRITICAL precious metal)
- Copper content: 5-30g per module quantified (secondary value component)
- Nickel content: <2g documented (plating component)
- Silver content: <1g documented (trace precious metal)
- Solder content: 2-15g documented (lead-free modern typical)
- PCB substrate: 5-50g documented (light memory modules)
- Semiconductor chip weight: 3-20g documented (DRAM silicon dies)
- Hazmat screening: Pb <0.1%, Cd <0.01%, Hg <0.001% (RoHS compliance)
- Material identity: COMPUTER MEMORY MODULES confirmed (JEDEC specification; authentic source)
- Generation-based value estimation: (gold content varies DDR2 higher, DDR4 lower)
Memory Generation & Type Verification
Content
- Memory generation: identified and documented (DDR2/DDR3/DDR4)
- JEDEC specification: confirmed (memory standard compliance)
- Pin count: documented (168/184/240/288/etc.)
- Module form factor: identified (DIMM/SO-DIMM/RIMM/etc.)
- Gold content estimation: based on generation characteristics
- Authenticity: memory module source verified
Explicit Requirement
MUST state:
- Memory module generation CONFIRMED (DDR2/DDR3/DDR4/DDR5)
- JEDEC specification verified
- module type identified (SDRAM/DIMM/SO-DIMM/etc.)
- pin count confirmed
- generation-based gold content estimated
- authentic computing memory source VERIFIED
Gold Edge Connector Verification
Explicit Requirement
MUST state:
- Gold edge connectors 0.02-0.15g per module CONFIRMED
- connector plating visible/verified
- precious metal connectivity architecture confirmed
- memory specification VERIFIED
- recovery-ready material confirmed
Generation-Based Gold Content Report
Content
- DDR2, memory: 0.10-0.15g gold per module (legacy higher plating)
- DDR3, memory: 0.05-0.10g gold per module (moderate plating)
- DDR4, memory: 0.02-0.05g gold per module (modern reduced plating)
- Generation mix analysis: homogeneity assessment
- Average gold per kilogram: calculated for lot valuation
Explicit Requirement
MUST state:
- Memory generation-based gold prediction: DDR2 = 0.10-0.15g (higher legacy)
- DDR3 = 0.05-0.10g (moderate)
- DDR4 = 0.02-0.05g (lower modern)
- generation-based value confirmed
Insurance Certificate
Minimum Coverage
- Memory Module E-Waste
- Edge Connector Gold
- Moderate-High Value
Rejection Criteria
Conditions and thresholds that trigger immediate rejection or downgrading.
Not computer memory modules
Threshold
Non-memory components identified; wrong form factor
Action
Full rejection
Reason
- Material Not Memory Modules
- Wrong Waste Stream
- Authentication Failure
Test Method
- Visual Inspection
- Generation/Pin Count Verification
Severity
CRITICAL - IDENTIFICATION FAILURE
Consequence:
- Full Rejection
- Material Completely Misidentified
Gold edge connectors missing or insufficient gold
Threshold
Gold <0.02g per module OR connectors damaged/missing/non-gold
Action
Full rejection or major downgrading
Reason
- Primary Value (Edge Connectors) Missing/Insufficient
- Precious Metal Recovery Not Economical
Test Method
- Visual Inspection
- Xrf Spectrometry
Severity
CRITICAL - COMMODITY SPECIFICATION VIOLATION
Consequence:
- Full Rejection
- Material Unsuitable For Processing
Generation unidentifiable or extreme generation mismatch
Threshold
Generation cannot be verified OR lot contains >50% unexpected generation (pricing model breaks)
Action
Full rejection or substantial reclassification
Reason
- Generation Mix Uncertainty
- Pricing Model Invalid
- Cannot Apply Generation-Weighted Valuation
Test Method
- Visual Generation Identification
- Pin Count Verification
- Documentation
Severity
CRITICAL - PRICING UNCERTAINTY
Consequence:
- Full Rejection Or Substantial Reclassification
- Generation Verification Mandatory
Mercury or extreme hazmat detected
Threshold
Mercury detected; hazmat extreme; RoHS non-compliant memory
Action
Full rejection or hazmat protocol
Reason
- Memory Non-Compliance
- Hazmat Processing Required
- Regulatory Violation
Test Method
- Xrf Spectrometry
- Hazmat Screening
Severity
CRITICAL - HAZMAT EXTREME
Consequence:
- Full Rejection
- Hazmat Disposal Protocols
Severe module degradation or corrosion
Threshold
Connectors heavily corroded; module non-functional; gold inaccessible; recovery negligible
Action
Full rejection or major downgrading
Reason
- Module Integrity Severely Compromised
- Connector Gold Recovery Hazardous/Impossible
Test Method
- Visual Assessment
- Structural Integrity Evaluation
Severity
CRITICAL - MATERIAL CONDITION
Consequence:
- Full Rejection
- Material Unsuitable For Recovery