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Class 1-C Modern Motherboards
Electronic Scrap

Class 1-C Modern Motherboards

Grade: VariousHigh Tier

Post-2000 colored motherboards (Pentium 4+), lower gold content

Market Price EstimateUpdated Daily
$1,850/ MT
+95 (5.4%)vs yesterday
Verified specifications & market data

Chemical Composition

Elemental breakdown by percentage weight.

Standard composition limits
Values represent maximum allowed percentage unless otherwise noted.

Physical Properties

Material form, density, and contamination specifications.

Post-2000 consumer computer motherboards; end-of-life modern computing equipment; low precious metal content (0.005-0.05g gold; 20-80g copper); RoHS-compliant (lead-free solder, halogen-free flame retardants); ubiquitous e-waste stream; highest supplier count commodity; volume-driven bulk commodity; minimal precious metal recovery per unit; environmental/hazmat straightforward (RoHS compliant; no legacy hazmat)

Acceptable Inclusions
  • Gold plating 0.005-0.05g (modern specification)
  • Copper 20-80g (base metal; valuable)
  • Lead-free solder 5-30g (modern standard; SAC305 safe)
  • Nickel <3g (plating component; acceptable)
  • Silver <3g (trace; minimal)
  • Epoxy-fiberglass substrate (inert)
  • Halogen-free flame retardant (modern standard; safe)
  • Minor dust/thermal compound residue (typical consumer use)
Prohibited Materials
  • Gold <0.005g per board (below modern specification; base waste)
  • Pre-2000 leaded solder (not modern; RoHS violation)
  • Batteries attached (active hazmat)
  • Mercury components (RoHS violation; modern non-compliant)
  • Unknown composition (RoHS status uncertain)

Quality Assurance

Testing protocols, sampling methods, and acceptance criteria.

Sampling Protocol
frequencyRandom sampling; RoHS compliance spot-check; minimal hazmat verification; straightforward assessment
maximumQuantity2000+ boards per shipment
minimumQuantity50-300 boards or 10-50 kg
percentage3-8% of lot
Acceptance Limits
all Criteria Must PassMaterial must be post-2000 RoHS-compliant; modern specification met; environmental/hazmat straightforward
board IntegrityBoard structurally sound; components intact; processing straightforward
copper PresentModerate copper confirmed; 20-80g expected; bulk commodity value established
modern Board StatusConfirmed as post-2000 modern RoHS-compliant motherboard; contemporary e-waste standard
rohs ComplianceRoHS compliant verified; lead-free solder confirmed; hazmat minimal/absent
Weight Tolerance
measurementBulk weighing acceptable; precision irrelevant; statistical standardization applied
variance±20-30% from estimated weight

Required Test Methods

Visual Modern Board Confirmation

Method 1
Purpose
  • Confirm post-2000 modern board (colored PCB)
  • verify RoHS-compliant appearance
  • assess condition
Acceptance Criteria
  • Modern colored PCB characteristic
  • post-2000 component styles visible
  • RoHS-compliant appearance evident
Procedure
  • Sample visual inspection
  • identify colored substrate (blue/green/red)
  • verify modern component styles
  • RoHS compliance indicators

RoHS Solder Verification

Method 2
Purpose
  • Verify lead-free solder (bright shiny appearance vs. dull leaded)
  • confirm RoHS compliance
Acceptance Criteria
  • Lead-free solder confirmed (modern bright appearance)
  • halogen-free material confirmed
Procedure
  • Visual solder assessment
  • bright/shiny characteristic
  • component inspection
  • material standard verification

Hazmat Screening

Method 3
Purpose
  • Confirm RoHS compliance
  • verify no mercury, cadmium, lead present
Acceptance Criteria
  • RoHS compliance confirmed
  • hazmat minimal
  • no legacy hazmat detected
Procedure
  • Visual inspection
  • RoHS material compliance assessment
  • straightforward verification (minimal testing)
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