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Class 1-B Industrial PCBs
Electronic Scrap

Class 1-B Industrial PCBs

Grade: VariousVery High Tier

Industrial circuit boards with gold plating and precious metal components

Market Price EstimateUpdated Daily
$3,450/ MT
+265 (8.3%)vs yesterday
Verified specifications & market data

Chemical Composition

Elemental breakdown by percentage weight.

Standard composition limits
Values represent maximum allowed percentage unless otherwise noted.

Physical Properties

Material form, density, and contamination specifications.

Industrial-grade circuit boards from end-of-life industrial equipment; machinery decommissioning, power distribution equipment retirement, telecommunications/networking equipment; significant precious metal content (variable; 0.03-0.20g gold; 30-150g copper; up to 15g silver); specialized industrial electronics recycling infrastructure; moderate supply; premium pricing; industrial equipment integration demanding; hazmat complexity variable

Acceptable Inclusions
  • Gold plating 0.03-0.20g (industrial PCB specification)
  • Copper 30-150g (heavy industrial component; valuable)
  • Silver <15g (precious metal; industrial-concentration typical; valuable)
  • Palladium <3g (precious metal trace; ultra-valuable)
  • Platinum <1g (precious metal trace; ultra-valuable)
  • Tin-lead or lead-free solder (variable; composition acceptable if documented)
  • Lead <80g solder (variable; industrial specification acceptable if within limits)
  • Nickel <10g (component; acceptable)
  • Industrial residue/oil (expected post-industrial)
  • Epoxy-fiberglass substrate (inert)
Prohibited Materials
  • Gold <0.03g per board (below industrial specification)
  • Consumer electronics boards (not industrial)
  • Mercury components present (hazmat extreme)
  • Batteries attached (active hazmat)
  • Severely degraded boards (no recovery value)
  • Unknown board composition or source (industrial uncertainty unacceptable)

Quality Assurance

Testing protocols, sampling methods, and acceptance criteria.

Sampling Protocol
frequencyStratified sampling by equipment type; board type variation sampling ; comprehensive hazmat screening
maximumQuantity200+ boards per shipment
minimumQuantity20-100 boards or 5-20 kg
percentage10-20% of lot
stratificationSample across equipment types; board types; ages/compliance eras; precious metal content by source; extreme by industrial era; verification
Acceptance Limits
all Criteria Must PassMaterial be industrial-grade with 0.03-0.20g gold + significant silver/copper + palladium possible; hazmat ; composition identifiable; industrial status
board IntegrityBoard structurally sound; components intact; processing feasibility ; environmental contamination manageable
copper ContentCopper 30-150g per board ; industrial component density ; base metal commodity value
gold ContentGold plating 0.03-0.20g per board ; precious metal industrial specification
hazmat ProfileLead/cadmium/mercury ; industrial compliance status ; hazmat uncertainty ; processing protocol
industrial Grade StatusConfirmed as -grade board; industrial application evident; equipment source identifiable; Class 1-B specification
precious Metal TracePalladium/platinum documented if present; ultra-precious components noted; potential ultra-high value
silver ContentSilver documented; precious metal secondary value
Weight Tolerance
measurementVerified by certified scale; weight accountability for premium industrial commodity; precious metal weight critical for pricing
variance±15% from expected weight

Required Test Methods

Visual Industrial Board Assessment

CRITICALMANDATORY
Method 1
Purpose
  • confirm industrial-grade boards (not consumer electronics)
  • identify equipment source (power supply vs. telecommunications vs. automation)
  • assess composition variability and hazmat risk profile
Acceptance Criteria
  • Industrial board characteristics unmistakably evident
  • heavy copper/industrial components visible
  • equipment type recognizable
  • industrial-grade specification apparent
Procedure
  • 100% visual inspection
  • identify industrial board characteristics (heavier traces, industrial connectors, specialized component density, professional layout)
  • assess equipment application from board design
  • estimate board age/standards compliance
  • preliminary hazmat assessment from solder appearance (dull gray = lead-based
  • shiny = lead-free)

Equipment Type & Source Classification

CRITICAL
Method 2
Purpose
  • categorize by equipment source (power supply/telecommunications/industrial automation/specialized)
  • estimate precious metal composition
  • assess hazmat risk profile
  • authenticate industrial status
Acceptance Criteria
  • Equipment type clearly identified
  • board classification confirmed
  • precious metal profile estimated
  • hazmat risk profile established
Procedure
  • Visual equipment assessment
  • identify component styles and board layout characteristic of equipment type
  • estimate manufacturing era from design
  • assess standards compliance likelihood (pre-RoHS vs. modern)
  • document equipment application and specialization

Gold/Silver/Palladium Content Assessment

Method 3
Purpose
  • verify gold 0.03-0.20g, silver <15g (often HIGHER than consumer), palladium <3g
  • assess precious metal value
  • INDUSTRIAL BOARDS OFTEN HIGHER density than consumer
Acceptance Criteria
  • Gold/silver/palladium documented
  • precious metal composition VARIABLE but
  • industrial-grade specification
Procedure
  • XRF spectrometry (multiple sample points
  • precious metal distribution variable by board type)
  • identify gold plating on connectors/traces/components
  • quantify silver in solder/contacts (industrial boards often high-silver)
  • detect palladium/platinum trace if present
  • establish precious metal recovery yield

Copper & Heavy Component Assessment

Method 4
Purpose
  • Quantify copper 30-150g (INDUSTRIAL
  • often 2-3× consumer boards)
  • assess heavy component density
  • confirm industrial weight characteristic
  • establish commodity base metal value
Acceptance Criteria
  • Copper content documented 30-150g range
  • heavy industrial weight characteristic
  • base metal value
Procedure
  • Weight estimation
  • visual copper layer assessment
  • identify heavy power traces/foils characteristic of industrial boards
  • estimate total copper percentage
  • confirm industrial-grade component density

Hazmat Screening - UNPREDICTABILITY FOCUS

EXTREMEMANDATORY
Method 5
Purpose
  • detect lead (VARIABLE 2-80g), cadmium, mercury
  • assess hazmat composition uncertainty
  • industrial equipment COMPLIANCE UNPREDICTABLE by era
  • ACCURATE hazmat profile ESSENTIAL for processing safety
Acceptance Criteria
  • Lead solder 2-80g
  • cadmium <0.01%
  • mercury <0.001%
  • industrial compliance status
  • processing protocol ESTABLISHED appropriate to hazmat profile
Procedure
  • XRF comprehensive hazmat screening (absolute
  • lead/cadmium/mercury detection)
  • ICP-AES ultra-sensitive for mercury if suspected
  • solder appearance analysis (visual lead-based vs. lead-free assessment)
  • industrial era estimation affects hazmat likelihood assessment
  • establish hazmat processing cost adjustment

Industrial Residue Assessment

Method 6
Purpose
  • Assess oil, dust, thermal compound, industrial contamination
  • determine cleaning requirement
  • evaluate processing feasibility and cost adjustment
  • characterize post-industrial condition
Acceptance Criteria
  • Residue type identified
  • contamination level
  • cleaning requirements
  • processing feasibility
  • occupational hazard assessment
Procedure
  • Visual residue assessment
  • identify oil/dust/thermal compound/industrial particles type and level
  • estimate percentage contamination
  • determine if secondary containment REQUIRED during processing
  • confirm cleaning protocol viability
  • assess occupational exposure risk
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