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Electronic Scrap
CPUs and Processors
Grade: VariousVery High Tier
Computer processors with gold bonding wire and pins
Market Price EstimateUpdated Daily
$3,650/ MT
+245 (7.2%)vs yesterday
Verified specifications & market data
Chemical Composition
Elemental breakdown by percentage weight.
Standard composition limits
Values represent maximum allowed percentage unless otherwise noted.
Physical Properties
Material form, density, and contamination specifications.
Post-use computer processors; CPU cores with ultra-high precious metal density; extreme precious metal content (0.10-0.80g gold bonding wire + 0.05-0.30g gold plating; 2-15g copper); specialized semiconductor recycling infrastructure; moderate-concentrated supply (189 suppliers); ultra-premium pricing tier; processor-specific expertise required; environmental protocols stringent (semiconductor industry standards); high-complexity material recovery (gold bonding wire extraction demanding)
Acceptable Inclusions
- Gold bonding wire 0.10-0.80g (specification)
- Gold lead plating 0.05-0.30g (specification)
- Copper 2-15g (base metal component)
- Silicon 0.5-5g (semiconductor die)
- Tin <3g (solder component)
- Nickel <2g (plating)
- Palladium <1g (rare trace)
- Ceramic substrate 1-10g (inert)
- Thermal compound residue (typical)
Prohibited Materials
- Gold <0.10g per processor (below specification)
- Mercury components (hazmat extreme)
- Batteries attached (active hazmat)
- Unknown processor composition
Quality Assurance
Testing protocols, sampling methods, and acceptance criteria.
Sampling Protocol
frequencyStratified random sampling from processor types; generations; architectures; manufacturer verification; precious metal verification critical
maximumQuantity500-1000+ processors per shipment
minimumQuantity25-100 processors or 2-5 kg
percentage25-35% of lot
stratificationSample across processor manufacturers; generations; architectures; sizes; bonding wire assessment comprehensive
Acceptance Limits
all Criteria Must PassMaterial must be genuine processor; gold bonding wire 0.10-0.80g ; purity 99.99% ; generation identified; ultra-premium status authenticated
gold Plating LeadsGold plating leads 0.05-0.30g per processor confirmed; secondary gold component
gold PurityUltra-pure semiconductor-grade gold 99.99%
goldbonding Wire ContentGold bonding wire 0.10-0.80g per processor ; ultra-premium specification ; precious metal density confirmed
hazmat ComplianceNo mercury detected; RoHS compliance verified; environmental hazmat
processor AuthenticityConfirmed as genuine computer processor; processor type/manufacturer verified; authenticity
processor GenerationProcessor generation/architecture ; bonding wire density aligned with specification
ultrapremium StatusUltra-premium tier ; highest precious metal density computing component
Weight Tolerance
measurementVerified by certified precision scale; weight accountability for precious metal commodity critical
variance±1% from expected weight
Required Test Methods
Visual Inspection & Processor Authentication
CRITICAL
Purpose
- authenticate processor type
- verify CPU authenticity (not counterfeit)
- estimate precious metal density
- assess condition
Acceptance Criteria
- Processor type unmistakably identifiable (Intel, AMD, ARM etc.)
- processor model/generation confirmed
- authenticity verified
- gold bonding wire characteristic visible
- counterfeit risk excluded
Procedure
- 100% visual inspection of sample
- identify processor markings/model/generation
- visual bonding wire assessment
- confirm manufacturer characteristics
- assess physical integrity
- exclude counterfeit processors
Processor Generation & Architecture Classification
CRITICAL
Purpose
- classify processor generation
- predict bonding wire density
- estimate gold content recovery
- validate ultra-premium specification
Acceptance Criteria
- Processor generation confirmed
- architecture classified
- gold bonding wire density estimated aligned with generation
- precious metal profile validated
- ultra-premium tier confirmed
Procedure
- Detailed visual assessment
- identify CPU architecture/generation
- consult processor specification database
- estimate bonding wire thickness/length
- project gold content per unit
Gold Bonding Wire & Precious Metal Assessment
CRITICAL
Purpose
- verify gold bonding wire 0.10-0.80g
- confirm ultra-pure semiconductor-grade gold
- assess ultra-premium status
- quantify precious metal value
Acceptance Criteria
- Gold bonding wire 0.10-0.80g VERIFIED per processor specification
- ultra-pure 99.99% characteristics evident
- gold plating leads 0.05-0.30g assessed
- ultra-premium precious metal density
- highest computing component classification validated
Procedure
- Microscopic visual assessment if available
- bonding wire characteristic evaluation
- gold plating lead assessment
- precious metal density ranking verification
- ultra-premium tier confirmation
Processor Authenticity & Counterfeit Detection
CRITICAL
Purpose
- detect counterfeit processors
- verify genuine CPU authenticity
- assess processor legitimacy
Acceptance Criteria
- Processor authenticity CONFIRMED (not counterfeit)
- genuine CPU characteristics verified
- manufacturer specification matched
- counterfeit risk excluded
Procedure
- Visual comparison to authentic reference
- markings verification
- physical characteristics assessment
- manufacturing detail verification
- counterfeit detection protocols
Hazmat & RoHS Compliance Screening
Purpose
- Detect mercury/extreme hazmat
- verify RoHS compliance
- assess occupational/environmental risk
Acceptance Criteria
- Mercury absent (hazmat extreme
- rare but checked)
- lead <0.1% (RoHS)
- cadmium <0.01%
- processor standard
- environmental compliance
XRF Spectrometry + Fire Assay
Purpose
- Verify ultra-pure gold bonding wire 99.99%
- quantify gold 0.10-0.80g
- confirm ultra-premium specification
- project recovery yield
Acceptance Criteria
- Gold bonding wire 0.10-0.80g
- purity 99.99% CONFIRMED (ultra-pure semiconductor-grade)
- copper 2-15g documented
- processor specification